Substrate/Film Coating and Drying Equipment

High-precision Coating Equipment

RS Coater™ Single-wafer Coating Equipment

Featuring an adjustable-width die head, the RS Coater can handle a wide variety of substrate shapes.

Features
• Unique adjustable-width head for use with a variety of coating shapes
• Patterned coating for reduced material loss
• Unique adjustable-width head for improved dispensing responsiveness
  • Highly stable dispensing from start to finish
  • Sharp corner edge coating
    (Support for rounded corners using the adjustable-width head)
  • No need for tricky correction recipes at start or end
• Handles high-viscosity liquids and thick coating
  (No need for overcoating even with thicknesses up to several hundred micrometers)
• Highly flexible single-wafer system for roll-to-roll prototyping and medium-volume production

Coats even unusual shapes!

Coating is even possible for the following shapes.

Superior coating thickness precision

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Thin coating of low-viscosity liquids is now possible
for full-surface coating applications!

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Capable of handling a wide variety of applications!

※Comparison of products by application

Specifications

1. Coating width: 300 mm max. (wide nozzle currently under development)
2. Viscosity: Several mPa·s (cps) to 50,000 mPa·s (cps)
3. Coating thickness: Up to 1,000 μm/Wet
4. Coating thickness precision: ±3 to 5% or less
5. Liquid utilization efficiency: 90% or more

※Contact us to discuss coating conditions to meet desired viscosities.
※Coating in environments with low dew points also supported.

Systems Solutions

Let us help you find a systems solution that’s right for you.

Process flow example:
Load port (EFEM) → Alignment → Coater → Bake → CP → Load port (EFEM)
Drying process option: Vacuum drying device (VCD)
Baking process option: Combination with Cure Oven, etc. possible

> Contact Chugai Ro