Single-wafer die coater (rectangular dedicated coating machine)

Single-wafer die coater (rectangular dedicated coating machine)

Since its launch in 1996, this mainstay product has sold a cumulative total of 400 units!

Product Overview High-precision coating is performed on sheet substrates such as glass, film, and paper using a die coater. Closed-circuit coating with a die coater minimizes the loss of coating liquid by minimizing solvent evaporation and other changes in the coating liquid. A wide range of coating is possible, from low viscosity to high viscosity. The system can also be combined with substrate cleaning equipment, robots, vacuum drying equipment, hot plates, ovens, etc!
Use
  • PI film for flexible displays
  • Interlayer dielectric (PI)
  • Photoresist for patterning
  • solder resist
  • overcoat
  • hard court
  • Partition wall / Dielectric
  • OCR
  • Electrode material application
  • CNT, etc.
Equipment Specifications
Maximum substrate dimensions 2,600mmW x 5,000mmL
Coating thickness Wet 10 μm or more (Dry 1 μm to 1,000 μm)
Viscosity of coating solution 0.001 to 100 Pa-s (1 to 100,000 cps)
Coating speed ≦200mm/sec
Film thickness accuracy ≦±3%
cleanliness class10

Smaller machines (A4 size substrate) for research and development are also available.
table coater®
indicates word or phrase being defined		 Features & Specifications
  • Realizes high-precision coating comparable to spin coaters
  • Coating of large size plates or sheets is also possible (MAX. 2600mm width)
  • Applicable to a wide range of viscosities from low to high viscosity (0.001 to 10 Pa-s)
  • Wide film thickness range from thin to thick films (0.05 to 1,000 μm/dry)
  • Cost-saving design with minimal loss of coating liquid
  • No change in coating liquid characteristics due to closed-circuit coating
  • Coating accuracy: ≦±3%
rough sketch

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